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The Chemical Computing Group MOE, http://wwwchemcompcom 22 Haynes T, Knisley D, Seier E, Zou Y A quantitative analysis of secondary RNA structure using domination based parameters on trees BMC Bioinform 2006;7:108, doi:101186/1471-2105-7-108 23 Haynes T, Knisley D, Knisley J, Zoe Y Using a neural network to identify RNA structures quanti ed by graphical invariants Submitted 24 Hoyosa HB Chem Soc Jpn 1971;44:2332 25 Haynes T, Hedetniemi S, Slater P Fundamentals of Domination in Graphs Marcel Dekker; 1998 26 Beineke, L Zam rescu C Connection digraphs and second order line graphs Discrete Math 1982;39:237 254 27 Dix D An application of iterated line graphs to biomolecular conformations Preprint 28 Gordon M, Scantlebury G Trans Faraday Soc 1964;60:604 29 Randic M J Am Chem Soc 1975;97:6609 30 Bonchev D The overall Weiner index a new tool for the characterization of molecular topology J Chem Inform Comput Sci 2001;41(3):582 592.

GPU Settings. These settings are used to detect your graphics processing unit (graphics card) and allow you to enable OpenGL if the graphics card supports it. If your systems graphics card doesn t support OpenGL, this area is grayed-out.

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In SMG, like in other TCs of ETSI the detailed work was done in the STCs. SMG itself was thus mostly co-ordinating the work of STCs, de ning their work programme, approving their deliverables and deciding about policy issues. The GSM standard consisted then of 140 speci cations and ten reports. The primary responsibility of each of these deliverables was allocated to a particular STC and to a rapporteur. Once the draft had reached a suf cient state of completeness and stability it was submitted to TC SMG for approval. From then on, other STCs based their work on this draft. This implied that any change must be brought to the attention of, and approved by, TC SMG. Proposed changes were presented in documents called Change Requests (CRs) complying with a precise format de ned by PT12. To give an impression of the amount of work, Figure 4.2 indicates the number of CRs approved by TC SMG at its Meeting Nos. 4 8. One notes the steady decrease of the number of CRs relative to GSM phase 1, corresponding to a maintenance phase in which they were mostly of an editorial nature and related to testing. For GSM phase 2 the number of CRs reached almost 300 at the SMG Meeting No. 8 at the end of 1993. Later it uctuated around

31 Balaban A Chem Phys Lett 1982;89:399 404..

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Among some of the advancements in VLSI technology in the recent years, highspeed silicon and GaAs technologies have been developed rapidly and propagation delay times of less than a picosecond per gate have been achieved. For VLSI circuits, the propagation delays and crosstalk noise associated with signal transmissions on interconnections have become the primary factors in limiting circuit speed and chip density. In most cases, interconnection delays on an IC chip account for more than 50% of the total delays. A comprehensive understanding of the dependence of the interconnection delays on the various interconnection parameters is needed for optimum chip design. The modern interconnection layout is an extremely high density structure with millions of metal lines running vertically and horizontally on various levels and layers. The interconnection delay models used in the industry have changed over time since the relative signi cance of the different interconnection parasitics has changed over time. Until a few years ago, only interconnection capacitances were considered to be signi cant enough to contribute to the overall chip delay. Then with the advent of complex circuits, heavy scaling and the use of longer interconnection lines made interconnection resistance an important factor in delay models. Interconnection delay models could be classi ed as lumped-capacitance models, simple RC models, lumped RC models, and distributed RC models. There has been an emphasis on nding different materials, fabrication techniques, and interconnection layouts to minimize RC delays. For modern ICs which are much faster and smaller, it is important to include interconnection inductances in the delay models. In fact, inductance is becoming as important as capacitance was a few years ago.

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